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hdipcbs

HDI PCBs (High-Density Interconnect Printed Circuit Boards) represent an advanced class of multilayer PCBs designed for extreme miniaturization and superior electrical performance.

Core Features & Technologies 

1.     Microvias (laser-drilled holes ≤0.10 mm diameter)

Blind Vias: Connect outer layers to inner layers (not through the entire board). 

Buried Vias: Link internal layers (invisible from the surface). 

       Stacked/Staggered: Multiple microvias layered vertically or offset for routing flexibility. 

       Via-in-Pad: Microvias drilled directly into component pads, saving space. 

2. Any-Layer Interconnect 

   Microvias can link any layer combination, enabling ultra-flexible routing. 

3. Advanced Materials 

   Low-loss dielectrics (Rogers, Panasonic M6) for high-speed signals. 

   Thin copper foils (9–18µm) and ultra-thin cores (50µm). 

4. Fine trace width/spacing (3/3mil≤)

HDI Complexity Levels 

1+N+1 (microvias on outer layers)

2+N+2 (2 microvia layers)

3+N+3 (3+ microvia layers)

Any-Layer (Microvias on all layers)

Key Advantages of HDI Technology

1. Miniaturization: Enables dramatically smaller and lighter electronic devices.

2. Enhanced Performance: Shorter signal paths reduce delay, noise, and power loss, improving speed and signal integrity.

3. Increased Functionality: Allows integration of more complex features and components into compact designs.

4. Improved Reliability: Advanced materials and construction techniques often enhance thermal management and overall robustness.

5. Potential Cost Savings: While manufacturing is complex, overall system cost can be reduced through smaller size, fewer materials, 

    and potentially fewer layers needed compared to complex conventional PCBs.

Applications

Smartphones, Tablets, Laptops, Compact Servers, AI/GPUs

Wearable Technology (Smartwatches, Fitness Trackers)

Advanced Medical Devices (Imaging, Implants, Diagnostics, Endoscopes, Pacemakers)

Automotive Electronics (ADAS, Infotainment, LiDAR, autonomous driving controllers)

High-Performance Computing & Networking Equipment

Aerospace & Avionics Systems

Military & Defense Systems

Miniaturized IoT Devices

Etc.

Guangdong HuiXinPu Circuit Co. Ltd

Phone: 0086-755-32813032

sales@hxpcircuit.com