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CAPABILITIES

​​​​​​No.

Items

Specification

1.    

Multilayer PCB

1-50 Layers

2.    

Rogers PCB

highly recommended

3.    

HDI PCB

highly recommended

4.    

Rigid-flex PCB

highly recommended

5.    

PCB assembly

Available

6.    

Max. board width

600mm

7.    

Max. board length

1000mm

8.    

Min. board thickness

0.2mm

9.    

FR-4 material

TG140/TG150/TG170/TG180

S1141/S1000-2M/KB-6160/KB-6165/KB-6167F/

IT-180A, etc.

10.          

High frequency material

RO4350B/RO4003C/RT5880/RO6002, etc.

11.          

Prepreg

1080/2116/7628/106/3313, etc.

12.          

Hybrid PCB

FR-4+Rogers / FR-4+Rigid polyimide material

13.          

Finished copper0.5 OZ

3/3mil Min. trace width/space

14.          

Finished copper1 OZ

3/3mil Min. trace width/space

15.          

Finished copper1.5 OZ

5/5mil Min. trace width/space

16.          

Finished copper2 OZ

7/7mil Min. trace width/space

17.          

Finished copper3 OZ

9/9mil Min. trace width/space

18.          

Finished copper4 OZ

11/11mil Min. trace width/space

19.          

Max. finished copper thickness

6oz

20.          

Soldermask thickness

10-25um

21.          

Soldermask brand

ABQ / Kuangshun / Taiyo

22.          

Soldermask color

Green/White/Black/Yellow/Red/Blue/Matte Green/

Matte Black,etc.

23.          

Soldermask plugged vias

≤0.50mm

24.          

Min. soldermask bridge

6mil

25.          

Silkscreen color

White/Black/Yellow

26.          

HASL / Lead free HASL

Tin Thickness: 2-35um

27.          

OSP

0.2-0.3um

28.          

Immersion gold / ENIG

Nickel: 120-240u"; Au:1-4u"

29.          

Immersion silver 

Silver: 0.1-0.3um

30.          

Immersion tin

Tin>1.0um

31.          

Hard gold fingers

Max. Au: 50u"

32.          

Hard gold plated whole PCB/

Selective hard gold plating

Max. Au: 50u"

33.          

Board thickness tolerance

Thickness<1.0mm:+/-0.1mm; Thickness>1.0mm+/-10%

34.          

Hole diameter tolerance

PTH:± 3mil; NPTH:± 2mil; Press Fit PTH ±2mil

35.          

Hole location tolerance

± 3mil

36.          

Slot dimension tolerance

± 0.1mm

37.          

Outline tolerance

±0.13mm

38.          

Depth controlled drilling/milling

Counterbore depth tolerance

±0.20mm

39.          

Etching tolerance

± 20%

40.          

Min. hole size

Mechanical drilling: 0.15mm;

Laser drilling: 0.1-0.15mm

41.          

Min slot width

0.6mm

42.          

Aspect ratio

12:1

43.          

Min. BGA pad diameter

8mil

44.          

Peelable mask

0.2-0.5mm

45.          

Carbon print

0.1-0.35mm

46.          

Castellated holes/Half holes

Available, min.0.5mm

47.          

Vias filled & plate over /

VIPPO

Available, max.0.5mm

48.          

Countersink / Counterbore

Available

49.          

Buried vias

Available, min.0.15mm

50.          

Blind vias

Available, min. 0.1mm

51.          

Edge plating

Available

52.          

Impedance control

Available, tolerance ± 10%

53.          

Laser drilling

Available

54.          

Back drilling

Available, hole Size: 0.5-6.5mm, depth control ±0.1mm

55.          

V-score / Jump V-score

Available, angle 30°/45°/60°



Dongguan HuiXinPu Circuit Co. Ltd

Phone: 0086-755-32813032

sales@hxpcircuit.com